Tài liệu Khoa học nano và công nghệ. Khái niệm thiết kế và vật liệu

Contents
Preface xi
Chapter 1. Engineering Fundamentals of MEMS and MOEMS
Electronic Packaging 1
1.1 The Package as the Vital Bridge 2
1.2 Packaging Challenges 3
1.3 Multiple Functions 7
1.3.1 Protection 7
1.3.2 Connectivity 8
1.3.3 Compatibility; chip-to-package 11
1.3.4 Compatibility; package-to-printed circuits 13
1.3.5 Routing 14
1.3.6 Electronic routing 15
1.3.7 Materials routing 15
1.3.8 Mechanical stress control 16
1.3.9 Thermal management 17
1.3.10 Assembly simplification 17
1.3.11 Performance enhancement 18
1.3.12 Testability and burn-in 18
1.3.13 Removability and reworkability 18
1.3.14 Standardization 19
1.4 Package Types 19
1.4.1 Fully hermetic packages 19
1.4.2 Nonhermetic plastic 23
1.4.3 Overmolding capped devices 25
1.4.4 Near-hermetic package—a new class 26
1.5 Reliability and Qualification 27
1.6 Summary 28
Chapter 2. Principles, Materials, and Fabrication of MEMS and
MOEMS Devices 29
2.1 Definitions and Classifications 31
2.2 Basic Principles 33
2.3 Sensing 34
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viii Contents
2.4 MEMS Sensor Principles 35
2.4.1 Inertial (motion) sensors 35
2.4.2 Pressure sensors 37
2.4.3 Chemical sensors 38
2.5 Motion Actuation 39
2.6 MEMS “Engines” 40
2.6.1 Electrostatic/capacitance 40
2.6.2 Electromagnetic actuators 42
2.6.3 Bimorphic actuators 42
2.6.4 Piezoelectric actuators 43
2.6.5 Other actuators 43
2.7 CAD Structure Library; Building Blocks 44
2.7.1 Device materials 44
2.7.2 Fabrication methods and strategies 45
2.8 MEMS Devices 46
2.8.1 Sensors 47
2.8.2 Controllers 48
2.9 Optical-MEMS; MOEMS 49
2.10 Intelligent MEMS 49
2.11 MEMS Applications 50
2.11.1 MEMS sensors; endless applications 50
2.12 MOEMS Devices—MEMS Plus Light 58
2.12.1 Light control principles 58
2.12.2 Applications for optical MEMS (MOEMS) 59
2.13 Summary 63
Chapter 3. MEMS and MOEMS Packaging Challenges
and Strategies 65
3.1 Product-Specific Character of MEMS Packaging 65
3.2 MEMS General Packaging Requirements 66
3.2.1 Free space (gas, vacuum, or fluid) 66
3.2.2 Free space (fluid) 69
3.2.3 Low contamination 70
3.2.4 Minimal stress 71
3.2.5 Temperature limitations 72
3.2.6 In-package environmental control 73
3.2.7 Selective access to outside 74
3.2.8 Mechanical shock limits 75
3.2.9 Stiction 76
3.2.10 RF shielding 77
3.2.11 Fluidics management 77
3.2.12 High-vacuum enclosures 79
3.2.13 Device as the package 79
3.2.14 Cost 79
3.3 Hermeticity; Levels, Evaluation Methods, and Requirements;
Perceived versus Actual 80
3.4 Cost versus Performance Trade-offs 82
3.5 Emergence of Low-Cost Near-Hermetic Packaging 82
3.5.1 Definition and description 82
3.5.2 Material choices 83
3.5.3 Interconnect schemes 84
3.6 Manufacturing Process Comparisons 84
3.6.1 Metal packages 84
3.6.2 Ceramic packages 86
3.6.3 Plastic packages: plastic versus ceramic 90
3.6.4 Chip assembly in plastic packages 103
3.6.5 Lid sealing 103
3.6.6 Package barrier issues 105
3.6.7 Hermeticity testing of injection molded packages 106
3.6.8 Package enhancement 108
3.6.9 Productivity using strips and arrays 110
3.6.10 Acceptance of NHP molded package technology 111
3.6.11 Status of NHP and MEMS-specific packaging 111
3.7 The Packaging MOEMS (Optical-MEMS)—Additional Requirements 112
3.7.1 Windows and ports 112
3.7.2 Maintaining optical clarity 115
3.7.3 Dimensional stability 115
3.7.4 Thermal management 115
3.7.5 In-package dynamic alignment 116
3.8 Packages for Materials Handling 116
3.8.1 Design concepts 117
3.8.2 Fluidic systems 117
3.8.3 Gas/airborne agent analyzers 117
3.8.4 Nanoscale particles and MEMS 118
3.8.5 Selectivity for ports 118
3.9 NHP Beyond MEMS 118
Chapter 4. MEMS Packaging Processes 121
4.1 Release Step 123
4.1.1 Stiction and cleaning 125
4.2 Singulation; Sawing and Protection 126
4.3 Capping Approaches 128
4.3.1 Dielectric caps 129
4.3.2 Caps with first-level interconnects 130
4.3.3 Caps with second-level interconnects 131
4.4 Die Attach 133
4.5 Wire Bonding 133
4.6 Flip Chip Methods 133
4.7 Tape Automated Bonding 136
4.8 Selective Underfill and Encapsulation 139
4.9 Lid Sealing 139
4.9.1 Thermal adhesive application 140
4.9.2 UV curing of sealants 141
4.9.3 Laser sealing 142
4.9.4 Ultrasonic sealing 144
4.9.5 Direct heat bonding 145
4.9.6 RF sealing/welding 145
4.9.7 Electric welding 146
4.9.8 Mechanical locking 146
4.9.9 Soldering 146
4.9.10 Brazing 146
4.9.11 Hinged-to-package lids 147
Contents ix
4.10 Antistiction Processes 148
4.11 In-Process Handling 151
4.12 Applying In-Package Additives 151
4.12.1 Getters application processes 151
4.12.2 Lubricant application 152
4.13 Equipment 152
4.14 Testing 152
4.15 Reliability 152
4.15.1 Contamination effects 153
4.16 Selecting the Right MEMS/MOEMS Package and Materials 154
4.16.1 The process cost overkill 154
4.17 Conclusions and Summary 155
Chapter 5. MEMS Packaging Materials 159
5.1 The Process Determines the Materials 159
5.1.1 Electrically conductive materials––interconnects 160
5.1.2 Surface finishes for metals 162
5.1.3 Enclosure materials 163
5.1.4 Organic plastics and their benefits 164
5.1.5 Epoxy limitations 167
5.1.6 Metals versus ceramics versus plastics 168
5.2 Joining Materials 171
5.3 Assembly Issues and Material Solutions 172
5.3.1 Protection during singulation 172
5.3.2 Die attach adhesives 173
5.3.3 Lid seal materials 174
5.4 In-Package Additives 174
5.4.1 Getters 175
5.4.2 Humidity control agents 177
5.4.3 Antistiction agents 178
5.4.4 Lubricants/antiwear agents 179
5.5 Conclusions 181
Chapter 6. From MEMS and MOEMS to Nanotechnology 183
6.1 Definitions Are Important 186
6.2 Combining Nano and MEMS 189
6.2.1 Nanomaterials added to MEMS and MOEMS devices 189
6.2.2 MEMS to handle nanomaterials 190
6.2.3 Nanocomponents for MEMS 190
6.2.4 Nanomeasurement 191
6.2.5 Nanodevices 192
6.2.6 Nanoelectronics devices 193
6.2.7 Nanoelectronics plus MEM 198
6.2.8 Nano enhanced packaging 198
6.3 Packaging Nano 200
6.4 Summary, Conclusions, and the Future 201